Method of manufacture of a linear stepper actuator ink jet printer

ABSTRACT

A method of manufacturing an ink jet printhead includes providing a substrate. A doped layer is deposited on the substrate and is etched to create an array of nozzles on the substrate with a nozzle chamber in communication with each nozzle. Planar monolithic deposition, lithographic and etching processes are used to form a plunger arranged reciprocally within each nozzle chamber to be displaceable towards and away from the nozzle to effect ink ejection and nozzle chamber refill, respectively, and an actuator arranged externally of the nozzle chamber to effect reciprocation of the plunger.

CROSS REFERENCES TO RELATED APPLICATIONS

The following Australian provisional patent applications are hereby incorporated by cross-reference. For the purposes of location and identification, US patent applications identified by their US patent application serial numbers (USSN) are listed alongside the Australian applications from which the US patent applications claim the right of priority.

US PATENT/PATENT APPLICATION CROSS-REFERENCED (CLAIMING RIGHT AUSTRALIAN OF PRIORITY FROM DOC- PROVISIONAL PATENT AUSTRALIAN PRO- KET APPLICATION NO. VISIONAL APPLICATION) NO. PO7991 09/113,060 ART01 PO8505 09/113,070 ART02 PO7988 09/113,073 ART03 PO9395 09/112,748 ART04 PO8017 09/112,747 ART06 PO8014 09/112,776 ART07 PO8025 09/112,750 ART08 PO8032 09/112,746 ART09 PO7999 09/112,743 ART10 PO7998 09/112,742 ART11 PO8031 09/112,741 ART12 PO8030 09/112,741 ART13 PO7997 09/112,739 ART15 PO7979 09/113,053 ART16 PO8015 09/112,738 ART17 PO7978 09/113,067 ART18 PO7982 09/113,063 ART19 PO7989 09/113,069 ART20 PO8019 09/112,744 ART21 PO7980 09/113,058 ART22 PO8018 09/112,777 ART24 PO7938 09/113,224 ART25 PO8016 09/112,804 ART26 PO8024 09/112,805 ART27 PO7940 09/113,072 ART28 PO7939 09/112,785 ART29 PO8501 09/112,797 ART30 PO8500 09/112,796 ART31 PO7987 09/113,071 ART32 PO8022 09/112,824 ART33 PO8497 09/113,090 ART34 PO8020 09/112,823 ART38 PO8023 09/113,222 ART39 PO8504 09/112,786 ART42 PO8000 09/113,051 ART43 PO7977 09/112,782 ART44 PO1934 09/113,056 ART45 PO7990 09/113,059 ART46 PO8499 09/113,09/ ART47 PO8502 09/112,753 ART48 PO7981 09/113,055 ART50 PO7986 09/113,057 ART51 PO7983 09/113,054 ART52 PO8026 09/112,752 ART53 PO8027 09/112,759 ART54 PO8028 09/112,757 ART56 PO9394 09/112,758 ART57 PO9396 09/113,107 ART58 PO9397 09/112,829 ART59 PO9398 09/112,792 ART60 PO9399 6,106,147 ART61 PO9400 09/112,790 ART62 PO9401 09/112,789 ART63 PO9402 09/112,788 ART64 PO9403 09/112,795 ART65 PO9405 09/112,749 ART66 PP0959 09/112,784 ART68 PP1397 09/112,783 ART69 PP2370 09/112,781 DOT01 PP2371 09/113,052 DOT02 PO8003 09/112,834 Fluid01 PO8005 09/113,103 Fluid02 PO9404 09/113,101 Fluid03 PO8066 09/112,751 IJ01 PO8072 09/112,787 IJ02 PO8040 09/112,802 IJ03 PO8071 09/112,803 IJ04 PO8047 09/113,097 IJ05 PO8035 09/113,099 IJ06 PO8044 09/113,084 IJ07 PO8063 09/113,066 IJ08 PO8057 09/112,778 IJ09 PO8056 09/112,779 IJ10 PO8069 09/113,077 IJ11 PO8049 09/113,061 IJ12 PO8036 09/112,818 IJ13 PO8048 09/112,816 IJ14 PO8070 09/112,772 IJ15 PO8067 09/112,819 IJ16 PO8001 09/112,815 IJ17 PO8038 09/113,096 IJ18 PO8033 09/113,068 IJ19 PO8002 09/113,095 IJ20 PO8068 09/112,808 IJ21 PO8062 09/112,809 IJ22 PO8034 09/112,780 IJ23 PO8039 09/113,083 IJ24 PO8041 09/113,121 IJ25 PO8004 09/113,122 IJ26 PO8037 09/112,793 IJ27 PO8043 09/112,794 IJ28 PO8042 09/113,128 IJ29 PO8064 09/113,127 IJ30 PO9389 09/112,756 IJ31 PO9391 09/112,755 IJ32 PP0888 09/112,754 IJ33 PP0891 09/112,811 IJ34 PP0890 09/112,812 IJ35 PP0873 09/112,813 IJ36 PP0993 09/112,814 IJ37 PP0890 09/112,764 IJ38 PP1398 09/112,765 IJ39 PP2592 09/112,767 IJ40 PP2593 09/112,768 IJ41 PP3991 09/112,807 IJ42 PP3987 09/112,806 IJ43 PP3985 09/112,820 IJ44 PP3983 09/112,821 IJ45 PO7935 09/112,822 IJM01 PO7936 09/112,825 IJM02 PO7937 09/112,826 IJM03 PO8061 09/112,827 IJM04 PO8054 09/112,828 IJM05 PO8065 6,071,750 IJM06 PO8055 09/113,108 IJM07 PO8053 09/113,109 IJM08 PO8078 09/113,123 IJM09 PO7933 09/113,114 IJM10 PO7950 09/113,115 IJM11 PO7949 09/113,129 IJM12 PO8060 09/113,124 IJM13 PO8059 09/113,125 IJM14 PO8073 09/113,126 IJM15 PO8076 09/113,119 IJM16 PO8075 09/113,120 IJM17 PO8079 09/113,221 IJM18 PO8050 09/113,116 IJM19 PO8052 09/113,118 IJM20 PO7948 09/113,117 IJM21 PO7951 09/113,113 IJM22 PO8074 09/113,130 IJM23 PO7941 09/113,110 IJM24 PO8077 09/113,112 IJM25 PO8058 09/113,087 IJM26 PO8051 09/113,074 IJM27 PO8045 6,110,754 IJM28 PO7952 09/113,088 IJM29 PO8046 09/112,771 IJM30 PO9390 09/112,769 IJM31 PO9392 09/112,770 IJM32 PP0889 09/112,798 IJM35 PP0887 09/112,801 IJM36 PP0882 09/112,800 IJM37 PP0874 09/112,799 IJM38 PP1396 09/113,098 IJM39 PP3989 09/112,833 IJM40 PP2591 09/112,832 IJM41 PP3990 09/112,831 IJM42 PP3986 09/112,830 IJM43 PP3984 09/112,836 IJM44 PP3982 09/112,835 IJM45 PP0895 09/113,102 IR01 PP0870 09/113,106 IR02 PP0869 09/113,105 IR04 PP0887 09/113,104 IR05 PP0885 09/112,810 IR06 PP0884 09/112,766 IR10 PP0886 09/113,085 IR12 PP0871 09/113,086 IR13 PP0876 09/113,094 IR14 PP0877 09/112,760 IR16 PP0878 09/112,773 IR17 PP0879 09/112,774 IR18 PP0883 09/112,775 IR19 PP0880 6,152,619 IR20 PP0881 09/113,092 IR21 PO8006 6,087,638 MEMS02 PO8007 09/113,093 MEMS03 PO8008 09/113,062 MEMS04 PO8010 6,041,600 MEMS05 PO8011 09/113,082 MEMS06 PO7947 6,067,797 MEMS07 PO7944 09/113,080 MEMS09 PO7946 6,044,646 MEMS10 PO9393 09/113,065 MEMS11 PP0875 09/113,078 MEMS12 PP0894 09/113,075 MEMS13

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

FIELD OF THE INVENTION

The present invention relates to the manufacture of ink jet printheads and, in particular, discloses a method of manufacture of a linear stepper actuator ink jet printer.

BACKGROUND OF THE INVENTION

Many ink jet printing mechanisms are known. Unfortunately, in mass production techniques, the production of ink jet heads is quite difficult. For example, often, the orifice or nozzle plate is constructed separately from the ink supply and ink ejection mechanism and bonded to the mechanism at a later stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)). These separate material processing steps required in handling such precision devices often add a substantial expense in manufacturing.

Additionally, side shooting ink jet technologies (U.S. Pat. No. 4,899,181) are often used but again, this limits the amount of mass production throughput given any particular capital investment.

Additionally, more esoteric techniques are also often utilised. These can include electroforming of nickel stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), electro-discharge machining, laser ablation (U.S. Pat. No. 5,208,604), micro-punching, etc.

The utilisation of the above techniques is likely to add substantial expense to the mass production of ink jet printheads and therefore add substantially to their final cost.

It would therefore be desirable if an efficient system for the mass production of ink jet print heads could be developed.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide for an alternative form of ink jet printer which utilises a linear stepper actuator to eject ink from a nozzle chamber.

In accordance with a first aspect of the present invention, there is provided a method of manufacturing a linear stepper actuator ink jet printhead wherein an array of nozzles are formed on a substrate utilising planar monolithic deposition, lithographic and etching processes. Preferably, multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer.

The printheads can be formed utilising standard vlsi/ulsi processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably are of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate.

In accordance with a further aspect of the present invention, there is provided a method of manufacture of an ink jet printhead arrangement including a series of nozzle chambers, the method comprising the steps of: (a) utilizing an initial semiconductor wafer having an electrical circuitry layer formed thereon; (b) depositing and etching a first sacrificial layer forming a lower electrical coil mould; (c) depositing and etching a first conductive material layer including a lower electrical coil portion interconnected with the electrical circuitry layer; (d) depositing and etching an inert material layer over the first conductive material layer, the inert material layer including predetermined vias for interconnection of the first conductive material layer with subsequent layers; (e) depositing and etching a second sacrificial layer including etching a mould for a fixed magnetic pole, a series of moving poles, horizontal guides and a core pusher rod; (f) depositing and etching a high saturation flux material layer to form the fixed magnetic pole, the series of moving poles, the horizontal guides and the core pusher rod; (g) depositing and etching a second inert material layer over the high saturation flux material layer including predetermined vias for interconnection of lower layers with subsequent layers; (h) depositing and etching a second conductive material layer including a side electrical coil portion interconnected with the first conductive material layer; (i) depositing and etching a third conductive material layer including a top electrical coil portion interconnected with the side conductive material layer; (j) depositing and etching a hydrophobic material layer to form a plunger element surrounding the core pusher rod; (k) depositing and etching a third sacrificial material layer to form a nozzle chamber mould; (l) depositing and etching a third layer of inert material around the plunger element forming a nozzle chamber; (m) etching an ink supply channel to the nozzle chamber; (n) etching away the sacrificial layers.

The conductive layers can comprise substantially copper and the inert layers can comprise substantially silicon nitride. The hydrophobic layer can comprise substantially polytetrafluoroethylene. The wafer can comprise a double sided polished CMOS wafer.

The steps are preferably also utilized to simultaneously separate the wafer into separate printheads.

BRIEF DESCRIPTION OF THE DRAWINGS

Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:

FIG. 1 is a cut-out top view of an ink jet nozzle in accordance with the preferred embodiment;

FIG. 2 is an exploded perspective view illustrating the construction of a single ink jet nozzle in accordance with the preferred embodiment;

FIG. 3 provides a legend of the materials indicated in FIGS. 4 to 24; and

FIG. 4 shows a sectional side view of an initial manufacturing step of an ink jet printhead nozzle showing a silicon wafer layer with an electrical circuitry layer;

FIG. 5 shows a step of etching a sacrificial material layer;

FIG. 6 shows a step of applying and developing a resist layer;

FIG. 7 shows a step of stripping the resist layer;

FIG. 8 shows a step of applying and developing a further resist layer;

FIG. 9 shows a step of applying a metal layer;

FIG. 10 shows a step of stripping the further resist layer;

FIG. 11 shows a step of depositing yet a further layer of resist;

FIG. 12 shows a step of applying a copper layer;

FIG. 13 shows a step of applying still a further layer of resist;

FIG. 14 shows a step of applying a further copper layer;

FIG. 15 shows a step of stripping the still further layer of resist;

FIG. 16 shows a step of depositing and stripping a polymer layer;

FIG. 17 shows a step of depositing a sacrificial material layer;

FIG. 18 shows a step of depositing a further sacrificial material layer;

FIG. 19 shows a step of etching the sacrificial material layers;

FIG. 20 shows a step of depositing and etching a glass layer;

FIG. 21 shows a step of further etching the glass layer;

FIG. 22 shows a step of back etching through the silicon wafer layer;

FIG. 23 shows a step of etching the sacrificial material layers; and

FIG. 24 shows a step of filling the completed ink jet nozzle with ink.

DESCRIPTION OF PREFERRED AND OTHER EMBODIMENTS

In the preferred embodiment, a linear stepper motor is utilised to control a plunger device. The plunger device compresses ink within a nozzle chamber so as to thereby cause the ejection of ink from the chamber on demand.

Turning to FIG. 1, there is illustrated a single nozzle arrangement 10 as constructed in accordance with the preferred embodiment. The nozzle arrangement 10 includes a nozzle chamber 11 into which ink flows via a nozzle chamber filter portion 14 which includes a series of posts which filter out foreign bodies in the ink inflow. The nozzle chamber 11 includes an ink ejection port 15 for the ejection of ink on demand. Normally, the nozzle chamber 11 is filled with ink.

A linear actuator 16 is provided for rapidly driving a nickel ferrous plunger 18 into the nozzle chamber 11 so as to compress the volume of ink within chamber 11 to thereby cause ejection of drops from the ink ejection port 15. The plunger 18 is connected to the stepper moving pole actuator 16 which is actuated by means of a three phase arrangement of electromagnets 20 to 31. The electromagnets are driven in three phases with electromagnets 20, 26, 23 and 29 being driven in a first phase, electromagnets 21, 27, 24, 30 being driven in a second phase and electromagnets 22, 28, 25, 31 being driven in a third phase. The electromagnets are driven in a reversible manner so as to withdraw plunger 18 via actuator 16. The actuator 16 is guided at one end by a means of guide 33, 34. At the other end, the plunger 18 is coated with a hydrophobic material such as polytetrafluoroethylene (PTFE) which can form a major part of the plunger 18. The PFIE acts to repel the ink from the nozzle chamber 11 resulting in the creation of a membrane eg. 38, 39 (See FIG. 24a) between the plunger 18 and side walls eg. 36, 37. The surface tension characteristics of the membranes 38, 39 act to balance one another thereby guiding the plunger 18 within the nozzle chamber. The meniscus eg. 38, 39 further stops ink from flowing out of the chamber 11 and hence the electromagnets 20 to 31 can be operated in normal air.

The nozzle arrangement 10 is therefore operated to eject drops on demand by means of activating the actuator 16 by appropriately synchronised driving of electromagnets 20 to 31. The actuation of the actuator 16 results in the plunger 18 moving towards the nozzle ink ejection port 15 thereby causing ink to be ejected from the port 15.

Subsequently, the electromagnets are driven in reverse sequence thereby moving the plunger 18 in an opposite direction resulting in the inflow of ink from an ink supply connected to the ink inlet port 14.

Preferably, multiple ink nozzle arrangements 10 can be constructed adjacent to one another to form a multiple nozzle ink ejection mechanism. The nozzle arrangements 10 are preferably constructed in an array printhead constructed on a single silicon wafer which is subsequently diced in accordance with requirements. The diced printheads can then be interconnected to an ink supply which can comprise a through chip ink flow or ink flow from the side of a chip.

Turning now to FIG. 2, there is shown an exploded perspective of the various layers of the nozzle arrangement 10. The nozzle arrangement can be constructed on top of a silicon wafer 40 which has a standard electronic circuitry layer such as a two level metal CMOS layer 41. The two metal CMOS provides the drive and control circuitry for the ejection of ink from the nozzles by interconnection of the electromagnets to the CMOS layer. On top of the CMOS layer 41 is a nitride passivation layer 42 which passivates the lower layers against any ink erosion in addition to any etching of the lower CMOS glass layer should a sacrificial etching process be utilised in the construction of the nozzle arrangement 10.

On top of the nitride layer 42 is constructed various other layers. The wafer layer 40, the CMOS layer 41 and the nitride passivation layer 42 are constructed with the appropriate vias for interconnecting to the above layers. On top of the nitride layer 42 is constructed a bottom copper layer 43 which interconnects with the CMOS layer 41 as appropriate. Next, a nickel ferrous layer 45 is constructed which includes portions for the core of the electromagnets and the actuator 16 and guides 31, 32. On top of the NiFe layer 45 is constructed a second copper layer 46 which forms the rest of the electromagnetic device. The copper layer 46 can be constructed utilising a dual damascene process. Next a PTFE layer 47 is laid down followed by a nitride layer 48 which includes the side filter portions 14 and side wall portions 36 of the nozzle chamber. In the top of the nitride layer 48, the ejection port 15 and the rim 51 are constructed by means of etching. In the top of the nitride layer 48 is also provided a number of apertures 50 which are provided for the sacrificial etching of any sacrificial material utilised in the construction of the various lower layers including the nitride layer 48.

It will be understood by those skilled in the art of construction of micro-electro-mechanical systems (MEMS) that the various layers 43, 45 to 48 can be constructed by means of utilising a sacrificial material to deposit the structure of various layers and subsequent etching away of the sacrificial material as to release the structure of the nozzle arrangement 10.

For a general introduction to a micro-electro mechanical system (MEMS) reference is made to standard proceedings in this field including the proceedings of the SPIE (International Society for Optical Engineering), volumes 2642 and 2882 which contain the proceedings for recent advances and conferences in this field.

One form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:

1. Using a double sided polished wafer 40, complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process. This step is shown in FIG. 4. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. FIG. 3 is a key to representations of various materials in these manufacturing diagrams, and those of other cross referenced ink jet configurations.

2. Deposit 1 micron of sacrificial material 60.

3. Etch the sacrificial material and the CMOS oxide layers down to second level metal using Mask 1. This mask defines the contact vias 61 from the second level metal electrodes to the solenoids. This step is shown in FIG. 5.

4. Deposit a barrier layer of titanium nitride (TiN) and a seed layer of copper.

5. Spin on 2 microns of resist 62, expose with Mask 2, and develop. This mask defines the lower side of the solenoid square helix. The resist acts as an electroplating mold. This step is shown in FIG. 6.

6. Electroplate 1 micron of copper 63. Copper is used for its low resistivity (which results in higher efficiency) and its high electromigration resistance, which increases reliability at high current densities.

7. Strip the resist and etch the exposed barrier and seed layers. This step is shown in FIG. 7.

8. Deposit 0.1 microns of silicon nitride.

9. Deposit a seed layer of cobalt nickel iron alloy. CoNiFe is chosen due to a high saturation flux density of 2 Tesla, and a low coercivity. [Osaka, Tetsuya et al, A soft magnetic CoNiFe film with high saturation magnetic flux density, Nature 392, 796-798 (1998)].

10. Spin on 3 microns of resist 64, expose with Mask 3, and develop. This mask defines all of the soft magnetic parts, being the fixed magnetic pole of the solenoids, the moving poles of the linear actuator, the horizontal guides, and the core of the ink plunger. The resist acts as an electroplating mold. This step is shown in FIG. 8.

11. Electroplate 2 microns of CoNiFe 65. This step is shown in FIG. 9.

12. Strip the resist and etch the exposed seed layer. This step is shown in FIG. 10.

13. Deposit 0.1 microns of silicon nitride (Si3N4) (Not shown).

14. Spin on 2 microns of resist 66, expose with Mask 4, and develop. This mask defines the solenoid vertical wire segments 67, for which the resist acts as an electroplating mold. This step is shown in FIG. 11.

15. Etch the nitride down to copper using the Mask 4 resist.

16. Electroplate 2 microns of copper 68. This step is shown in FIG. 12.

17. Deposit a seed layer of copper.

18. Spin on 2 microns of resist 70, expose with Mask 5, and develop. This mask defines the upper side of the solenoid square helix. The resist acts as an electroplating mold. This step is shown in FIG. 13.

19. Electroplate 1 micron of copper 71. This step is shown in FIG. 14.

20. Strip the resist and etch the exposed copper seed layer, and strip the newly exposed resist. This step is shown in FIG. 15.

21. Open the bond pads using Mask 6.

22. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.

23. Deposit 5 microns of PTFE 72.

24. Etch the PTFE down to the sacrificial layer using Mask 7. This mask defines the ink plunger. This step is shown in FIG. 16.

25. Deposit 8 microns of sacrificial material 73. Planarize using CMP to the top of the PNFE ink pusher. This step is shown in FIG. 17.

26. Deposit 0.5 microns of sacrificial material 75. This step is shown in FIG. 18.

27. Etch all layers of sacrificial material using Mask 8. This mask defines the nozzle chamber wall 36. This step is shown in FIG. 19.

28. Deposit 3 microns of PECVD glass 76.

29. Etch to a depth of (approx.) 1 micron using Mask 9. This mask defines the nozzle rim 51. This step is shown in FIG. 20.

30. Etch down to the sacrificial layer using Mask 10. This mask defines the roof of the nozzle chamber, the nozzle 15, and the sacrificial etch access holes 50. This step is shown in FIG. 21.

31. Back-etch completely through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using Mask 11. Continue the back-etch through the CMOS glass layers until the sacrificial layer is reached. This mask defines the ink inlets 80 which are etched through the wafer. The wafer is also diced by this etch. This step is shown in FIG. 22.

32. Etch the sacrificial material. The nozzle chambers are cleared, the actuators freed, and the chips are separated by this etch. This step is shown in FIG. 23.

33. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the ink inlets at the back of the wafer.

34. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.

35. Hydrophobize the front surface of the printheads.

36. Fill the completed printheads with ink 81 and test them. A filled nozzle is shown in FIG. 24.

Further, it would be readily understood that various other forms of construction, including substitution of various materials for other suitable materials and variations in the utilisation of nitride passivation layers will be readily evident to those skilled in the art, with the preferred embodiment providing a merely illustrative example of the present invention.

It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiment without departing from the spirit or scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respects to be illustrative and not restrictive.

The presently disclosed ink jet printing technology is potentially suited to a wide range of printing systems including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers, high speed pagewidth printers, notebook computers with in-built pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic ‘minilabs’, video printers, PHOTO CD (PHOTO CD is a registered trade mark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.

Ink Jet Technologies

The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.

The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.

The most significant problem with piezoelectric ink jet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads with 19,200 nozzles.

Ideally, the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new ink jet technologies have been created. The target features include:

low power (less than 10 Watts)

high resolution capability (1,600 dpi or more)

photographic quality output

low manufacturing cost

small size (pagewidth times minimum cross section)

high speed (<2 seconds per page).

All of these features can be met or exceeded by the ink jet systems described below with differing levels of difficulty. Forty-five different ink jet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the list under the heading Cross References to Related Applications.

The ink jet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems

For ease of manufacture using standard process equipment, the printhead is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing. For color photographic applications, the printhead is 100 mm long, with a width which depends upon the ink jet type. The smallest printhead designed is covered in U.S. patent application Ser. No. 09/112,764, which is 0.35 mm wide, giving a chip area of 35 square mm. The printheads each contain 19,200 nozzles plus data and control circuitry.

Ink is supplied to the back of the printhead by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The printhead is connected to the camera circuitry by tape automated bonding.

Tables of Drop-on-Demand Ink Jets

Eleven important characteristics of the fundamental operation of individual ink jet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.

The following tables form the axes of an eleven dimensional table of ink jet types.

Actuator mechanism (18 types)

Basic operation mode (7 types)

Auxiliary mechanism (8 types)

Actuator amplification or modification method (17 types)

Actuator motion (19 types)

Nozzle refill method (4 types)

Method of restricting back-flow through inlet (10 types)

Nozzle clearing method (9 types)

Nozzle plate construction (9 types)

Drop ejection direction (5 types)

Ink type (7 types)

The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of ink jet nozzle. While not all of the possible combinations result in a viable ink jet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations. Instead, certain ink jet types have been investigated in detail. Forty-five such inkjet types were filed simultaneously to the present application.

Other ink jet configurations can readily be derived from these forty-five examples by substituting alternative configurations along one or more of the 11 axes. Most of the forty-five examples can be made into ink jet printheads with characteristics superior to any currently available ink jet technology.

Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The simultaneously filed patent applications by the present applicant are listed by USSN numbers. In some cases, a print technology may be listed more than once in a table, where it shares characteristics with more than one entry.

Suitable applications for the ink jet technologies include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.

The information associated with the aforementioned 11 dimensional matrix are set out in the following tables.

ACTUATOR MECHANISM (APPLIED ONLY TO SELECTED INK DROPS) Description Advantages Disadvantages Examples Thermal An electrothermal Large force High power Canon Bubblejet bubble heater heats the ink to generated Ink carrier 1979 Endo et al GB above boiling point, Simple limited to water patent 2,007,162 transferring significant construction Low efficiency Xerox heater-in- heat to the aqueous No moving parts High pit 1990 Hawkins et ink, A bubble Fast operation temperatures al USP 4,899,181 nucleates and quickly Small chip area required Hewlett-Packard forms, expelling the required for actuator High mechanical TIJ 1982 Vaught et ink. stress al USP 4,490,728 The efficiency of the Unusual process is low, with materials required typically less than Large drive 0.05% of the electrical transistors energy being Cavitation causes transformed into actuator failure. kinetic energy of the Kogation reduces drop. bubble formation Large print heads are difficult to fabricate Piezo- A piezoelelectric crystal Low power Very large area Kyser et al USP electric such as lead consumption required for actuator 3,946,398 lanthanum zirconate Many ink types Difficult to Zoltan USP (PZT) is electrically can be used integrate with 3,683,212 activated, and either Fast operation electronics 1973 Stemme expands, shears, or High efficiency High voltage USP 3,747,120 bends to apply drive transistors Epson Stylus pressure to the ink, required Tektronix ejecting drops. Full pagewidth IJ04 print heads impractical due to actuator size Requires electrical poling in high field strengths during manufacture Electro- An electric field is Low power Low maximum Seiko Epson, strictive used to activate consumption strain (approx. Usui et all JP electrostriction in Many ink types 0.01%) 253401/96 relaxor materials such can be used Large area IJ04 as lead lanthanum Low thermal required for actuator zirconate titanate expansion due to low strain (PLZT) or lead Electric field Response speed magnesium niobate strength required is marginal (˜10 (PMN). (approx. 3.5 V/μm) μs) can be generated High voltage without difficulty drive transistors Does not require required electrical poling Full pagewidth print beads impractical due to actuator size Ferro- An electric field is Low power Difficult to IJ04 electric used to induce a phase consumption integrate with transition between the Many ink types electronics antiferroelectric (AFE) can be used Unusual and ferroelectric (FE) Fast operation materials such as phase. Perovskite (<1 μs) PLZSnT are materials such as tin Relatively high required modified lead longitudinal strain Actuators require lanthanum zirconate High efficiency a large area titanate (PLZSnT) Electric field exhibit large strains of strength of around 3 up to 1% associated V/μm can#be readily with the AFE to FE : provided phase transition. Electro- Conductive plates are Low power Difficult to IJ02, IJ04 static plates separated by a consumption operate electrostatic compressible or fluid Many ink types devices in an dielectric (usually air). can be used aqueous Upon application of a Fast operation environment voltage, the plates The electrostatic attract each other and actuator will displace ink, causing normally need to be drop election. The separated from the conductive plates may ink be in a comb or Very large area honeycomb structure; required to achieve or stacked to increase high forces the surface area and High voltage therefore the force. drive transistors may be required Full pagewidth print heads are not competitive due to actuator size Electro- A strong electric field Low current High voltage 1989 Saito et al, static pull is applied to the ink, consumption required USP 4,799,068 on ink whereupon Low temperature May be damaged 1989 Miura et al, electrostatic attraction by sparks due to air USP 4,810,954 accelerates the ink breakdown Tone-jet towards the print Required field medium. strength increases as the drop size decreases High voltage drive transistors required Electrostatic field attracts dust Permanent An electromagnet Low power Complex IJ07, IJ10 magnet directly attracts a consumption fabrication electro- permanent magnet, Many ink types Permanent magnetic displacing ink and can be used magnetic material causing drop ejection. Fast operation such as Neodymium Rare earth magnets High efficiency Iron Boron (NdFeB) with a field strength Easy extension required. around 1 Tesla can be from single nozzles High local used. Examples are: to pagewidth print currents required Samarium Cobalt heads Copper (SaCo) and magnetic metalization should materials in the be used for long neodymium iron boron electromigration family (NdFeB, lifetime and low NdDyFeBNb, resistivity NdDyFeB, etc) Pigmented inks are usually infeasible Operating temperature limited to the Curie temperature (around 540 K) Soft A solenoid induced a Low power Complex IJ01, IJ05, IJ08, magnetic magnetic field in a soft consumption fabrication IJ10, IJ12, IJ14, core electro- magnetic core or yoke Many ink types Materials not IJ15, IJ17 magnetic fabricated from a can be used usually present in a ferrous material such Fast operation CMOS fab such as as electroplated iron High efficiency NiFe, CoNiFe, or alloys such as CoNiFe Easy extension CoFe are required [1], CoFe, or NiFe from single nozzles High local alloys. Typically, the to pagewidth print currents required soft magnetic material heads Copper is in two parts, which metalization should are normally held be used for long apart by a spring. electromigration When the solenoid is lifetime and low actuated, the two parts resistivity attract, displacing the Electroplating is ink. required High saturation flux density is required (2.0-2.1 T is achievable with CoNiFe [1]) Lorenz The Lorenz force Low power Force acts as a IJ06, IJ11, IJ13, force acting on a current consumption twisting motion IJ16 carrying wire in a Many ink types Typically, only a magnetic field is can be used quarter of the utilized. Fast operation solenoid length This allows the High efficiency provides force in a magnetic field to be Easy extension useful direction supplied externally to from single nozzles High local the print head, for to pagewidth print currents required example with rare heads Copper earth permanent metalization should magnets. be used for long Only the current electromigration carrying wire need be lifetime and low fabricated on the print- resistivity head, simplifying Pigmented inks materials are usually requirements. infeasible Magneto- The actuator uses the Many ink types Force acts as a Fischenbeck, striction giant magnetostrictive can be used twisting motion USP 4,032,929 effect of materials Fast operation Unusual IJ25 such as Terfenol-D (an Easy extension materials such as alloy of terbium, from single nozzles Terfenol-D are dysprosium and iron to pagewidth print required developed at the Naval heads High local Ordnance Laboratory, High force is currents required hence Ter-Fe-NOL). available Copper For best efficiency, the metalization should actuator should be pre- be used for long stressed to approx. 8 electromigration MPa. lifetime and low resistivity Pre-stressing may be required Surface Ink under positive Low power Requires Silverbrook, EP tension pressure is held in a consumption supplementary force 0771 658 A2 and reduction nozzle by surface Simple to effect drop related patent tension. The surface construction separation applications tension of the ink is No unusual Requires special reduced below the materials required in ink surfactants bubble threshold, fabrication Speed may be causing the ink to High efficiency limited by surfactant egress from the Easy extension properties nozzle. from single nozzles to pagewidth print heads Viscosity The ink viscosity is Simple Requires Silverbrook, EP reduction locally reduced to construction supplementary force 0771 658 A2 and select which drops are No unusual to effect drop related patent to be ejected. A materials required in separation applications viscosity reduction can fabrication Requires special be achieved Easy extension ink viscosity electrothermally with from single nozzles properties most inks, but special to pagewidth print High speed is inks can be engineered heads difficult to achieve for a 100:1 viscosity Requires reduction. oscillating ink pressure A high temperature difference (typically 80 degrees) is required Acoustic An acoustic wave is Can operate Complex drive 1993 Hadimioglu generated and without a nozzle circuitry et al, EUP 550,192 focussed upon the plate Complex 1993 Elrod et al, drop ejection region. fabrication EUP 572,220 Low efficiency Poor control of drop position Poor control of drop volume Thermo- An actuator which Low power Efficient aqueous IJ03, IJ09, IJ17, elastic bend relies upon differential consumption operation requires a IJ18, IJ19, IJ20, actuator thermal expansion Many ink types thermal insulator on IJ21, IJ22, IJ23, upon Joule heating is can be used the hot side IJ24, IJ27, IJ28, used. Simple planar Corrosion IJ29, IJ30, IJ31, fabrication prevention can be IJ32, IJ33, IJ34, Small chip area difficult IJ35, IJ36, IJ37, required for each Pigmented inks IJ38, IJ39, IJ40, actuator may be infeasible, IJ41 Fast operation as pigment particles High efficiency may jam the bend CMOS actuator compatible voltages and currents Standard MEMS processes can be used Easy extension from single nozzles to pagewidth print heads High CTE A material with a very High force can Requires special IJ09, IJ17, IJ18, thermo- high coefficient of be generated material (e.g. PTFE) IJ20, IJ21, IJ22, elastic thermal expansion Three methods of Requires a PTFE IJ23, IJ24, IJ27, actuator (CTh) such as PTFE deposition are deposition process, IJ28, IJ29, IJ30, polytetrafluoroethylene under development: which is not yet IJ31, IJ42, IJ43, (PTFE) is used. As chemical vapor standard in ULSI IJ44 7 high CTE materials deposition (CVD), fabs are usually non- spin coating, and PTFE deposition conductive, a heater evaporation cannot be followed fabricated from a PTFE is a with high conductive material is candidate for low temperature (above incorporated. A 50 ∞m dielectric constant 350° C.) processing long PTFE bend insulation in ULSI Pigmented inks actuator with Very low power may be infeasible, polysilicon heater and consumption as pigment particles 15 mW power input Many ink types may jam the bend can provide 180 μN can be used actuator force and 10 μm Simple planar deflection. Actuator fabrication motions include: Small chip area Bend required for each Push actuator Buckle Fast operation Rotate High efficiency CMOS compatible voltages and currents Easy extension from single nozzles to pagewidth print heads Conduct-ive A polymer with a high High force can Requires special IJ24 polymer coefficient of thermal be generated materials thermo- expansion (such as Very low power development (High elastic PTFE) is doped with consumption CTE conductive actuator conducting substances Many ink types polymer) to increase its can be used Requires a PTFE conductivity to about 3 Simple planar deposition process, orders of magnitude fabrication which is not yet below that of copper. Small chip area standard in ULSI The conducting required for each fabs polymer expands actuator PTFE deposition when resistively Fast operation cannot be followed heated. High efficiency with high Examples of CMOS temperature (above conducting dopants compatible voltages 350° C.) processing include: and currents Evaporation and Carbon nanotubes Easy extension CVD deposition Metal fibers from single nozzles techniques cannot Conductive polymers to pagewidth print be used such as doped heads Pigmented inks polythiophene may be infeasible, Carbon granules as pigment particles may jam the bend actuator Shape A shape memory alloy High force is Fatigue limits IJ26 memory such as TiNi (also available (stresses maximum number alloy known as Nitinol- of hundreds of MPa) of cycles Nickel Titanium alloy Large strain is Low strain (1%) developed at the Naval available (more than is required to extend Ordinance Laboratory) 3%) fatigue resistance is thermally switched High corrosion Cycle rate between its weak resistance limited by heat martensitic state and Simple removal its high stiffness construction Requires unusual austenic state. The Easy extension materials (TiNi) shape of the actuator from single nozzles The latent heat of in its martensitic state to pagewidth print transformation must is deformed relative to heads be provided the austenic shape. Low voltage High current The shape change operation operation causes ejection of a Requires pre- drop. stressing to distort the martensitic state Linear Linear magnetic Linear Magnetic Requires unusual IJ12 Magnetic actuators include the actuators can be semiconductor Actuator Linear Induction constructed with materials such as Actuator (LIA), Linear high thrust, long soft magnetic alloys Permanent Magnet travel, and high (e.g. CoNiFe) Synchronous Actuator efficiency using Some varieties (LPMSA), Linear planar also require Reluctance semiconductor permanent magnetic Synchronous Actuator fabrication materials such as (LRSA), Linear techniques Neodymium iron Switched Reluctance Long actuator boron (NdFeB) Actuator (LSRA), and travel is available Requires the Linear Stepper Medium force is complex multi- Actuator (LSA). available phase drive circuitry Low voltage High current operation operation

BASIC OPERATION MODE Description Advantages Disadvantages Examples Actuator This is the simplest Simple operation Drop repetition Thermal ink jet directly mode of operation: the No external rate is usually Piezoelectric ink pushes ink actuator directly fields required limited to around 10 jet supplies sufficient Satellite drops kHz. However, this IJ01, IJ02, IJ03, kinetic energy to expel can be avoided if is not fundamental IJ04, IJ05, IJ06, the drop. The drop drop velocity is less to the method, but is IJ07, IJ09, IJ11, must have a sufficient than 4 m/s related to the refill IJ12, IJ14, IJ16, velocity to overcome Can be efficient, method normally IJ20, IJ22, IJ23, the surface tension. depending upon the used IJ24, IJ25, IJ26, actuator used All of the drop IJ27, IJ28, IJ29, kinentic energy must IJ30, IJ31, IJ32, be provided by the IJ33, IJ34, IJ35, actuator IJ36, IJ37, IJ38, Satellite drops IJ39, IJ40, IJ41, usually form if drop IJ42, IJ43, IJ44 velocity is greater than 4.5 m/s Proximity The drops to be Very simple print Requires close Silverbrook, EP printed are selected by head fabrication can proximity between 0771 658 A2 and some manner (e.g. be used the print head and related patent thermally induced The drop the print media or applications surface tension selection means transfer roller reduction of does not need to May require two pressurized ink). provide the energy print heads printing Selected drops are required to separate alternate rows of the separated from the ink the drop from the image in the nozzle by nozzle Monolithic color contact with the print print heads are medium or a transfer difficult roller. Electro- The drops to be Very simple print Requires very Silverbrook, EP static pull printed are selected by head fabrication can high electrostatic 0771 658 A2 and on ink some manner (e.g. be used field related patent thermally induced The drop Electrostatic field applications surface tension selection means for small nozzle Tone-Jet reduction of does not need to sizes is above air pressurized ink). provide the energy breakdown Selected drops are required to separate Electrostatic field separated from the ink the drop from the may attract dust in the nozzle by a nozzle strong electric field. Magnetic The drops to be Very simple print Requires Silverbrook, EP pull on ink printed are selected by head fabrication can magnetic ink 0771 658 A2 and some manner (e.g. be used Ink colors other related patent thermally induced The drop than black are applications surface tension selection means difficult reduction of does not need to Requires very pressurized ink). provide the energy high magnetic fields Selected drops are required to separate separated from the ink the drop from the in the nozzle by a nozzle strong magnetic field acting on the magnetic ink. Shutter The actuator moves a High speed (>50 Moving parts are IJ13, IJ17, IJ21 shutter to block ink kHz) operation can required flow to the nozzle. The be achieved due to Requires ink ink pressure is pulsed reduced refill time pressure modulator at a multiple of the Drop timing can Friction and wear drop ejection be very accurate must be considered frequency. The actuator Stiction is energy can be very possible low Shuttered The actuator moves a Actuators with Moving parts are IJ08, IJ15, IJ18, grill shutter to block ink small travel can be required IJ19 flow through a grill to used Requires ink the nozzle. The shutter Actuators with pressure modulator movement need only small force can be Friction and wear be equal to the width used must be considered of the grill holes. High speed (>50 Stiction is kHz) operation can possible be achieved Pulsed A pulsed magnetic Extremely low Requires an IJ10 magnetic field attracts an ‘ink energy operation is external pulsed pull on ink pusher’ at the drop possible magnetic field pusher ejection frequency. An No heat Requires special actuator controls a dissipation materials for both catch, which prevents problems the actuator and the the ink pusher from ink pusher moving when a drop is Complex not to be ejected. construction

AUXILIARY MECHANISM (APPLIED TO ALL NOZZLES) Description Advantages Disadvantages Examples None The actuator directly Simplicity of Drop ejection Most ink jets, fires the ink drop, and construction energy must be including there is no external Simplicity of supplied by piezoelectric and field or other operation individual nozzle thermal bubble. mechanism required. Small physical actuator IJ01, IJ02, IJ03, size IJ04, IJ05, IJ07, IJ09, IJ11, IJ12, IJ14, IJ20, IJ22, IJ23, IJ24, IJ25, IJ26, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ35, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Oscillating The ink pressure Oscillating ink Requires external Silverbrook, EP ink pressure oscillates, providing pressure can provide ink pressure 0771 658 A2 and (including much of the drop a refill pulse, oscillator related patent acoustic ejection energy. The allowing higher Ink pressure applications stimul- actuator selects which operating speed phase and amplitude IJ08, IJ13, IJ15, ation) drops are to be fired The actuators must be carefully IJ17, IJ18, IJ19, by selectively may operate with controlled IJ21 blocking or enabling much lower energy Acoustic nozzles. The ink Acoustic lenses reflections in the ink pressure oscillation can be used to focus chamber must be may be achieved by the sound on the designed for vibrating the print nozzles head, or preferably by an actuator in the ink supply. Media The print head is Low power Precision Silverbrook, EP proximity placed in close High accuracy assembly required 0771 658 A2 and proximity to the print Simple print head Paper fibers may related patent medium. Selected construction cause problems applications drops protrude from Cannot print on the print head further rough substrates than unselected drops, and contact the print medium. The drop soaks into the medium fast enough to cause drop separation. Transfer Drops are printed to a High accuracy Bulky Silverbrook, EP roller transfer roller instead Wide range of Expensive 0771 658 A2 and of straight to the print print substrates can Complex related patent medium. A transfer be used construction applications roller can also be used Ink can be dried Tektronix hot for proximity drop on the transfer roller melt piezoelectric separation. inkjet Any of the IJ series Electro- An electric field is Low power Field strength Silverbrook, EP static used to accelerate Simple print head required for 0771 658 A2 and selected drops towards construction separation of small related patent the print medium. drops is near or applications above air Tone-Jet breakdown Direct A magnetic field is Low power Requires Silverbrook, EP magnetic used to accelerate Simple print head magnetic ink 0771 658 A2 and field selected drops of construction Requires strong related patent magnetic ink towards magnetic field applications the print medium. Cross The print head is Does not require Requires external IJ06, IJ16 magnetic placed in a constant magnetic materials magnet field magnetic field. The to be integrated in Current densities Lorenz force in a the print head may be high, current carrying wire manufacturing resulting in is used to move the process electromigration actuator problems Pulsed A pulsed magnetic Very low power Complex print IJ10 magnetic field is used to operation is possible head construction field cyclically attract a Small print head Magnetic paddle, which pushes size materials required in on the ink. A small print head actuator moves a catch, which selectively prevents the paddle from moving.

ACTUATOR AMPLIFICATION OR MODIFICATION METHOD Description Advantages Disadvantages Examples None No actuator Operational Many actuator Thermal Bubble mechanical simplicity mechanisms have Inkjet amplification is used. insufficient travel, IJ01, IJ02, IJ06, The actuator directly or insufficient force, IJ07, IJ16, IJ25, drives the drop to efficiently drive IJ26 ejection process. the drop ejection process Differential An actuator material Provides greater High stresses are Piezoelectric expansion expands more on one travel in a reduced involved IJ03, IJ09, IJ17, bend side than on the other. print head area Care must be IJ18, IJ19, IJ20, actuator The expansion may be taken that the IJ21, IJ22, IJ23, thermal, piezoelectric, materials do not IJ24, IJ27, IJ29, magnetostrictive, or delaminate IJ30, IJ31, IJ32, other mechanism. The Residual bend IJ33, IJ34, IJ35, bend actuator converts resulting from high IJ36, IJ37, IJ38, a high force low travel temperature or high IJ39, IJ42, IJ43, actuator mechanism to stress during IJ44 high travel, lower formation force mechanism. Transient A trilayer bend Very good High stresses are IJ40, IJ41 bend actuator where the two temperature stability involved actuator outside layers are High speed, as a Care must be identical. This cancels new drop can be taken that the bend due to ambient fired before heat materials do not temperature and dissipates delaminate residual stress. The Cancels residual actuator only responds stress of formation to transient heating of one side or the other. Reverse The actuator loads a Better coupling Fabrication IJ05, IJ11 spring spring. When the to the ink complexity actuator is turned off, High stress in the the spring releases. spring This can reverse the force/distance curve of the actuator to make it compatible with the force/time requirements of the drop ejection. Actuator A series of thin Increased travel Increased Some stack actuators are stacked. Reduced drive fabrication piezoelectric inkjets This can be voltage complexity IJ04 appropriate where Increased actuators require high possibility of short electric field strength, circuits due to such as electrostatic pinholes and piezoelectric actuators. Multiple Multiple smaller Increases the Actuator forces IJ12, IJ13, IJ18, actuators actuators are used force available from may not add IJ20, IJ22, IJ28, simultaneously to an actuator linearly, reducing IJ42, IJ43 move the ink. Each Multiple efficiency actuator need provide actuators can be only a portion of the positioned to control force required. ink flow accurately Linear A linear spring is used Matches low Requires print IJ15 Spring to transform a motion travel actuator with head area for the with small travel and higher travel spring high force into a requirements longer travel, lower Non-contact force motion. method of motion transformation Coiled A bend actuator is Increases travel Generally IJ17, IJ21, IJ34, actuator coiled to provide Reduces chip restricted to planar IJ35 greater travel in a area implementations reduced chip area. Planar due to extreme implementations are fabrication difficulty relatively easy to in other orientations. fabricate. Flexure A bend actuator has a Simple means of Care must be IJ10, IJ19, IJ33 bend small region near the increasing travel of taken not to exceed actuator fixture point, which a bend actuator the elastic limit in flexes much more the flexure area readily than the Stress remainder of the distribution is very actuator. The actuator uneven flexing is effectively Difficult to converted from an accurately model even coiling to an with finite element angular bend, resulting analysis in greater travel of the actuator tip. Catch The actuator controls a Very low Complex IJ10 small catch. The catch actuator energy construction either enables or Very small Requires external disables movement of actuator size force an ink pusher that is Unsuitable for controlled in a bulk pigmented inks manner. Gears Gears can be used to Low force, low Moving parts are IJ13 increase travel at the travel actuators can required expense of duration. be used Several actuator Circular gears, rack Can be fabricated cycles are required and pinion, ratchets, using standard More complex and other gearing surface MEMS drive electronics methods can be used. processes Complex construction Friction, friction, and wear are possible Buckle plate A buckle plate can be Very fast Must stay within S. Hirata et al, used to change a slow movement elastic limits of the “An Ink-jet Head actuator into a fast achievable materials for long Using Diaphragm motion. It can also device life Microactuator”, convert a high force, High stresses Proc. IEEE MEMS, low travel actuator involved Feb. 1996, pp 418- into a high travel, Generally high 423. medium force motion. power requirement IJ18, IJ27 Tapered A tapered magnetic Linearizes the Complex IJ14 magnetic pole can increase magnetic construction pole travel at the expense force/distance curve of force. Lever A lever and fulcrum is Matches low High stress IJ32, IJ36, IJ37 used to transform a travel actuator with around the fulcrum motion with small higher travel travel and high force requirements into a motion with Fulcrum area has longer travel and no linear movement, lower force. The lever and can be used for can also reverse the a fluid seal direction of travel. Rotary The actuator is - High mechanical Complex IJ28 impeller connected to a rotary advantage construction impeller. A small The ratio of force Unsuitable for angular deflection of to travel of the pigmented inks the actuator results in actuator can be a rotation of the matched to the impeller vanes, which nozzle requirements push the ink against by varying the stationary vanes and number of impeller out of the nozzle. vanes Acoustic A refractive or No moving parts Large area 1993 Hadimioglu lens diffractive (e.g. zone required et al, EUP 550,192 plate) acoustic lens is Only relevant for 1993 Elrod et al, used to concentrate acoustic inkjets EUP 572,220 sound waves. Sharp A sharp point is used Simple Difficult to Tone-jet conductive to concentrate an construction fabricate using point electrostatic field. standard VLSI processes for a surface ejecting ink- jet Only relevant for electrostatic ink jets

ACTUATOR MOTION Description Advantages Disadvantages Examples Volume The volume of the Simple High energy is Hewlett-Packard expansion actuator changes, construction in the typically required to Thermal Ink jet pushing the ink in all case of thermal ink achieve volume Canon Bubblejet directions. jet expansion. This leads to thermal stress, cavitation, and kogation in thermal ink jet implementations Linear, The actuator moves in Efficient High fabrication IJ01, IJ02, IJ04, normal to a direction normal to coupling to ink complexity may be IJ07, IJ11, IJ14 chip surface the print head surface. drops ejected required to achieve The nozzle is typically normal to the perpendicular in the line of surface motion movement. Parallel to The actuator moves Suitable for Fabrication IJ12, IJ13, IJ15, chip surface parallel to the print planar fabrication complexity IJ33,, IJ34, IJ35, head surface. Drop Friction IJ36 ejection may still be Stiction normal to the surface. Membrane An actuator with a The effective Fabrication 1982 Howkins push high force but small area of the actuator complexity USP 4,459,601 area is used to push a becomes the Actuator size stiff membrane that is membrane area Difficulty of in contact with the ink. integration in a VLSI process Rotary The actuator causes Rotary levers Device IJ05, IJ08, IJ13, the rotation of some may be used to complexity IJ28 element, such a grill or increase travel May have impeller Small chip area friction at a pivot requirements point Bend The actuator bends A very small Requires the 1970 Kyser et al when energized. This change in actuator to be made USP 3,946,398 may be due to dimensions can be from at least two 1973 Stemme differential thermal converted to a large distinct layers, or to USP 3,747, 120 expansion, motion. have a thermal IJ03, IJ09, IJ10, piezoelectric difference across the IJ19, IJ23, IJ24, expansion, actuator IJ25, IJ29, IJ30, magnetostriction, or IJ31, IJ33, IJ34, other form of relative IJ35 dimensional change. Swivel The actuator swivels Allows operation Inefficient IJ06 around a central pivot. where the net linear coupling to the ink This motion is suitable force on the paddle motion where there are is zero opposite forces Small chip area applied to opposite requirements sides of the paddle, e.g. Lorenz force. Straighten The actuator is Can be used with Requires careful IJ26, IJ32 normally bent, and shape memory balance of stresses straightens when alloys where the to ensure that the energized. austenic phase is quiescent bend is planar accurate Double The actuator bends in One actuator can Difficult to make IJ36, IJ37, IJ38 bend one direction when be used to power the drops ejected by one element is two nozzles. both bend directions energized, and bends Reduced chip identical. the other way when size. A small another element is Not sensitive to efficiency loss energized. ambient temperature compared to equivalent single bend actuators. Shear Energizing the Can increase the Not readily 985 Fishbeck actuator causes a shear effective travel of applicable to other USP 4,584,590 motion in the actuator piezoelectric actuator material. actuators mechanisms Radial con- The actuator squeezes Relatively easy High force 1970 Zoltan USP striction an ink reservoir, to fabricate single required 3,683,212 forcing ink from a nozzles from glass Inefficient constricted nozzle. tubing as Difficult to macroscopic integrate with VLSI structures processes Coil/uncoil A coiled actuator Easy to fabricate Difficult to IJ17, IJ21, IJ34, uncoils or coils more as a planar VLSI fabricate for non- IJ35 tightly. The motion of process planar devices the free end of the Small area Poor out-of-plane actuator ejects the ink. required, therefore stiffness low cost Bow The actuator bows (or Can increase the Maximum travel IJ16, IJ18, IJ27 buckles) in the middle speed of travel is constrained when energized. Mechanically High force rigid required Push-Pull Two actuators control The structure is Not readily IJ18 a shutter. One actuator pinned at both ends, suitable for ink jets pulls the shutter, and so has a high out-of- which directly push the other pushes it. plane rigidity the ink Curl A set of actuators curl Good fluid flow Design IJ20, IJ42 inwards inwards to reduce the to the region behind complexity volume of ink that the actuator they enclose. increases efficiency Curl A set of actuators curl Relatively simple Relatively large IJ43 outwards outwards, pressurizing construction chip area ink in a chamber surrounding the actuators, and expelling ink from a nozzle in the chamber. Iris Multiple vanes enclose High efficiency High fabrication IJ22 a volume of ink. These Small chip area complexity simultaneously rotate, Not suitable for reducing the volume pigmented inks between the vanes. Acoustic The actuator vibrates The actuator can Large area 1993 Hadimioglu vibration at a high frequency. be physically distant required for et al, EUP 550,192 from the ink efficient operation 1993 Elrod et al, at useful frequencies EUP 572,220 Acoustic coupling and crosstalk Complex drive circuitry Poor control of drop volume and position None In various ink jet No moving parts Various other Silverbrook, EP designs the actuator tradeoffs are 0771 658 A2 and does not move. required to related patent eliminate moving applications parts Tone-jet

NOZZLE REFILL METHOD Description Advantages Disadvantages Examples Surface This is the normal way Fabrication Low speed Thermal ink jet tension that inkjets are simplicity Surface tension Piezoelectric ink refilled. After the Operational force relatively jet actuator is energized, simplicity small compared to IJ01-IJ07, IJ10- it typically returns actuator force IJ14, IJ16, IJ20, rapidly to its normal Long refill time IJ22-IJ45 position. This rapid usually dominates return sucks in air the total repetition through the nozzle rate opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area. This force refills the nozzle. Shuttered Ink to the nozzle High speed Requires IJ08, IJ13, IJ15, oscillating chamber is provided at Low actuator common ink IJ17, IJ18, IJ19, ink pressure a pressure that energy, as. the pressure oscillator IJ21 oscillates at twice the actuator need only May not be drop ejection open or close the suitable for frequency. When a shutter, instead of pigmented inks drop is to be ejected, ejecting the ink drop the shutter is opened for 3 half cycles. drop ejection, actuator return, and refill. The shutter is then closed to prevent the nozzle chamber emptying during the next negative pressure cycle. Refill After the main High speed, as Requires two IJ09 actuator actuator has ejected a the nozzle is independent drop a second (refill) actively refilled actuators per nozzle actuator is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again. Positive ink The ink is held a slight High refill rate, Surface spill Silverbrook, EP pressure positive pressure. therefore a high must be prevented 0771 658 A2 and After the ink drop is drop repetition rate Highly related patent ejected, the nozzle is possible hydrophobic print applications chamber fills quickly head surfaces are Alternative for:, as surface tension and required IJ01-IJ07, IJ10- ink pressure both IJ14, IJ16, IJ20, operate to refill the IJ22-IJ45 nozzle.

METHOD OF RESTRICTING BACK-FLOW THROUGH INLET Description Advantages Disadvantages Examples Long inlet The ink inlet channel Design simplicity Restricts refill Thermal ink jet channel to the nozzle chamber Operational rate Piezoelectric ink is made long and simplicity May result in a jet relatively narrow, Reduces relatively large chip IJ42, IJ43 relying on viscous crosstalk area drag to reduce inlet Only partially back-flow. effective Positive ink The ink is under a Drop selection Requires a Silverbrook, EP pressure positive pressure, so and separation method (such as a 0771 658 A2 and that in the quiescent forces can be nozzle rim or related patent state some of the ink reduced effective applications drop already protrudes Fast refill time hydrophobizing, or Possible from the nozzle. both) to prevent operation of the This reduces the flooding of the following: IJ01- pressure in the nozzle ejection surface of IJ07, IJ09-IJ12, chamber which is the print head. IJ14, IJ16, IJ20, required to eject a IJ22,, IJ23-IJ34, certain volume of ink. IJ36-IJ41, IJ44 The reduction in chamber pressure results in a reduction in ink pushed out through the inlet. Baffle One or more baffles The refill rate is Design HP Thermal Ink are placed in the inlet not as restricted as complexity Jet ink flow. When the the long inlet May increase Tektronix actuator is energized, method. fabrication piezoelectric ink jet the rapid ink Reduces complexity (e.g. movement creates crosstalk Tektronix hot melt eddies which restrict Piezoelectric print the flow through the heads). inlet. The slower refill process is unrestricted, and does not result in eddies. Flexible flap In this method recently Significantly Not applicable to Canon restricts disclosed by Canon, reduces back-flow most ink jet inlet the expanding actuator for edge-shooter configurations (bubble) pushes on a thermal ink jet Increased flexible flap that devices fabrication restricts the inlet. complexity Inelastic deformation of polymer flap results in creep over extended use Inlet filter A filter is located Additional Restricts refill IJ04, IJ12, IJ24, between the ink inlet advantage of ink rate IJ27, IJ29, IJ30 and the nozzle filtration May result in chamber. The filter Ink filter may be complex has a multitude of fabricated with no construction small holes or slots, additional process restricting ink flow. steps The filter also removes particles which may block the nozzle. Small inlet The ink inlet channel Design simplicity Restricts refill IJ02, IJ37, IJ44 compared to the nozzle chamber rate to nozzle has a substantially May result in a smaller cross section relatively large chip than that of the nozzle area resulting in easier ink Only partially egress out of the effective nozzle than out of the inlet. Inlet shutter A secondary actuator Increases speed Requires separate IJ09 controls the position of of the ink-jet print refill actuator and a shutter, closing off head operation drive circuit the ink inlet when the main actuator is energized. The inlet is The method avoids the Back-flow Requires careful IJ01, IJ03, IJ05, located problem of inlet back- problem is design to minimize IJ06, IJ07, IJ10, behind the flow by arranging the eliminated the negative IJ11, IJ14, IJ16, ink-pushing ink-pushing surface of pressure behind the IJ22, IJ23, IJ25, surface the actuator between paddle IJ28, IJ31, IJ32, the inlet and the IJ33, IJ34, IJ35, nozzle. IJ36, IJ39, IJ40, IJ41 Part of the The actuator and a Significant Small increase in IJ07, IJ20, IJ26, actuator wall of the ink reductions in back- fabrication IJ38 moves to chamber are arranged flow can be complexity shut off the so that the motion of achieved inlet the actuator closes off Compact designs the inlet. possible Nozzle In some configurations Ink back-flow None related to Silverbrook, EP actuator of inkjet, there is no problem is ink back-flow on 0771 658 A2 and does not expansion or eliminated actuation related patent result in ink movement of an applications back-flow actuator which may Valve-jet cause ink back-flow Tone-jet through the inlet.

NOZZLE CLEARING METHOD Description Advantages Disadvantages Examples Normal All of the nozzles are No added May not be Most ink jet nozzle firing fired periodically, complexity on the sufficient to systems before the ink has a print head displace dried ink IJ01, IJ02, IJ03, chance to dry. When IJ04, IJ05, IJ06, not in use the nozzles IJ07; IJ09, IJ10, are sealed (capped) IJ11, IJ12, IJ14, against air. IJ16, IJ20, IJ22, The nozzle firing is IJ23, IJ24, IJ25, usually performed IJ26, IJ27, IJ28, during a special IJ29, IJ30, IJ31, clearing cycle, after IJ32, IJ33, IJ34, first moving the print IJ36, IJ37, IJ38, head to a cleaning IJ39, IJ40,, IJ41, station. IJ42, IJ43, IJ44,, IJ45 Extra In systems which heat Can be highly Requires higher Silverbrook, EP power to the ink, but do not boil effective if the drive voltage for 0771 658 A2 and ink heater it under normal heater is adjacent to clearing related patent situations, nozzle the nozzle May require applications clearing can be larger drive achieved by over- transistors powering the heater and boiling ink at the nozzle. Rapid, The actuator is fired in Does not require Effectiveness May be used success-ion rapid succession. In extra drive circuits depends with: IJ01, IJ02, of actuator some configurations, on the print head substantially upon IJ03, IJ04, IJ05, pulses this may cause heat Can be readily the configuration of IJ06, IJ07, IJ09, build-up at the nozzle controlled and the inkjet nozzle IJ10, IJ11, IJ14, which boils the ink, initiated by digital IJ16, IJ20, IJ22, clearing the nozzle. In logic IJ23, IJ24, IJ25, Other situations, it may IJ27, IJ28, IJ29, cause sufficient IJ30, IJ31, IJ32, vibrations to dislodge IJ33, IJ34, IJ36, clogged nozzles. IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44, IJ45 Extra Where an actuator is A simple Not suitable May be used power to not normally driven to solution where where there is a with: IJ03, IJ09, ink pushing the limit of its motion, applicable hard limit to IJ16, IJ20, IJ23, actuator nozzle clearing may be actuator movement IJ24, IJ25, IJ27; assisted by providing IJ29,IJ30, IJ31, an enhanced drive IJ32, IJ39, IJ40, signal to the actuator. IJ41, IJ42, IJ43, IJ44, IJ45 Acoustic An ultrasonic wave is A high nozzle High IJ08, IJ13, IJ15, resonance applied to the ink clearing capability implementation cost IJ17, IJ18, IJ19, chamber. This wave is can be achieved if system does not IJ21 of an appropriate May be already include an amplitude and implemented at very acoustic actuator frequency to cause low cost in systems sufficient force at the which already nozzle to clear include acoustic blockages. This is actuators easiest to achieve if the ultrasonic wave is at a resonant frequency of the ink cavity. Nozzle A microfabricated Can clear Accurate Silverbrook, EP clearing plate is pushed against severely clogged mechanical 0771 658 A2 and plate the nozzles. The plate nozzles alignment is dated patent has a post for every required applications nozzle. A post moves Moving parts are through each nozzle, required displacing dried ink. There is risk of damage to the nozzles Accurate fabrication is required Ink The pressure of the ink May be effective Requires May be used pressure is temporarily where other pressure pump or with all IJ series ink pulse increased so that ink methods cannot be other pressure jets streams from all of the used actuator nozzles. This may be Expensive used in conjunction Wasteful of ink with actuator energizing. Print head A flexible ‘blade’ is Effective for Difficult to use if Many inkjet wiper wiped across the print planar print head print head surface is systems head surface. The surfaces non-planar or very blade is usually Low cost fragile fabricated from a Requires flexible polymer, e.g. mechanical parts rubber or synthetic Blade can wear elastomer. out in high volume print systems Separate A separate heater is Can be effective Fabrication Can be used with ink boiling provided at the nozzle where other nozzle complexity many IJ series ink heater although the normal clearing methods jets drop e-ection cannot be used mechanism does not Can be require it. The heaters implemented at no do not require additional cost in individual drive some ink jet circuits, as many configurations nozzles can be cleared simultaneously, and no imaging is required.

NOZZLE PLATE CONSTRUCTION Description Advantages Disadvantages Examples Electro- A nozzle plate is Fabrication High Hewlett Packard formed separately fabricated simplicity temperatures and Thermal Ink jet nickel from electroformed pressures are nickel and bonded to required to bond the print head chip. nozzle plate Minimum thickness constraints Differential thermal expansion Laser Individual nozzle No masks Each hole must Canon Bubblejet ablated or holes are ablated by an required be individually 1988 Sercel et drilled intense UV laser in a Can be quite fast formed al., SPIE, Vol. 998 polymer nozzle plate, which is Some control Special Excimer Beam typically a polymer over nozzle profile equipment required Applications, pp. such as polyimide or is possible Slow where there 76-83 polysulphone Equipment are many thousands 1993 Watanabe required is relatively of nozzles per print et al., USP low cost head 5,208,604 May produce thin burrs at exit holes Silicon Aseparate nozzle High accuracy is Two part K. Bean, IEEE micro- plate is attainable construction Transactions on machined micromachined from High cost Electron Devices, single crystal silicon, Requires Vol. ED-25, No. 10, and bonded to the precision alignment 1978, pp 1185-1195 print head wafer. Nozzles may be Xerox 1990 clogged by adhesive Hawkins et al., USP 4,899,181 Glass Fine glass capillaries No expensive Very small 1970 Zoltan USP capillaries are drawn from glass equipment required nozzle sizes are 3,683,212 tubing. This method Simple to make difficult to form has been used for single nozzles Not suited for making individual mass production nozzles, but is difficult to use for bulk manufacturing of print heads with thousands of nozzles. Monolithic, The nozzle plate is High accuracy Requires Silverbrook, EP surface deposited as a layer (<1 μm) sacrificial layer 0771 658 A2 and micro- using standard VLSI Monolithic under the nozzle related patent machined deposition techniques. Low cost plate to form the applications using VLSI Nozzles are etched in Existing nozzle chamber IJ01, IJ02, IJ04, litho- the nozzle plate using processes can be Surface may be IJ11, IJ12, IJ13, IJ17, graphic VLSI lithography and used fragile to the touch IJ18, IJ20, IJ22, processes etching. IJ24, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Monolithic, The nozzle plate is a High accuracy Requires long IJ03, IJ05, IJ06, etched buried etch stop in the (<1 μm) etch times IJ07, IJ08, IJ09, through wafer. Nozzle Monolithic Requires a IJ10, IJ13, IJ14, substrate chambers are etched in Low cost support wafer IJ15, IJ16, IJ19, the front of the wafer, No differential IJ21, IJ23, IJ25, and the wafer is expansion IJ26 thinned from the back side. Nozzles are then etched in the etch stop layer. No nozzle Various methods have No nozzles to Difficult to Ricoh 1995 plate been tried to eliminate become clogged control drop Sekiya et al USP the nozzles entirely, to position accurately 5,412,413 prevent nozzle Crosstalk 1993 Hadimioglu clogging. These problems et al EUP 550,192 include thermal bubble 1993 Elrod et al mechanisms and EUP 572,220 acoustic lens mechanisms Trough Each drop ejector has Reduced Drop firing IJ35 a trough through manufacturing direction is sensitive which a paddle moves. complexity to wicking. There is no nozzle Monolithic plate. Nozzle slit The elimination of No nozzles to Difficult to 1989 Saito et al instead of nozzle holes and become clogged control drop USP 4,799,068 individual replacement by a slit position accurately nozzles encompassing many Crosstalk actuator positions problems reduces nozzle clogging, but increases crosstalk due to ink surface waves

DROP EJECTION DIRECTION Description Advantages Disadvantages Examples Edge Ink flow is along the Simple Nozzles limited Canon Bubblejet (‘edge surface of the chip, construction to edge 1979 Endo et al GB shooter’) and ink drops are No silicon High resolution patent 2,007,162 ejected from the chip etching required is difficult Xerox heater-in- edge. Good heat Fast color pit 1990 Hawkins et sinking via substrate printing requires al USP 4,899,181 Mechanically one print head per Tone-jet strong color Ease of chip handing Surface Ink flow is along the No bulk silicon Maximum ink Hewlett-Packard (‘roof surface of the chip, etching required flow is severely TIJ 1982 Vaught et shooter’) and ink drops are Silicon can make restricted al USP 4,490,728 ejected from the chip an effective heat IJ02, IJ11, IJ12, surface, normal to the sink IJ20, IJ22 plane of the chip. Mechanical strength Through Ink flow is through the High ink flow Requires bulk Silverbrook, EP chip, chip, and ink drops are Suitable for silicon etching 0771 658 A2 and forward ejected from the front pagewidth print related patent (‘up surface of the chip. heads applications shooter’) High nozzle IJ04, IJ17, IJ18, packing density IJ24, IJ27-IJ45 therefore low manufacturing cost Through Ink flow is through the High ink flow Requires wafer IJ01, IJ03, IJ05, chip, chip, and ink drops are Suitable for thinning IJ06, IJ07, IJ08, reverse ejected from the rear pagewidth print Requires special IJ09, IJ10, IJ13, (‘down surface of the chip. heads handling during IJ14, IJ15, IJ16, shooter’) High nozzle manufacture IJ19, IJ21, IJ23, packing density IJ25, IJ26 therefore low manufacturing cost Through Ink flow is through the Suitable for Pagewidth print Epson Stylus actuator actuator, which is not piezoelectric print heads require Tektronix hot fabricated as part of heads several thousand melt piezoelectric the same substrate as connections to drive ink jets the drive transistors. circuits Cannot be manufactured in standard CMOS fabs Complex assembly required

INK TYPE Description Advantages Disadvantages Examples Aqueous, Water based ink which Environmentally Slow drying Most existing ink dye typically contains: friendly Corrosive jets water, dye, surfactant, No odor Bleeds on paper All IJ series ink humectant, and May jets biocide. strikethrough Silverbrook, EP Modern ink dyes have Cockles paper 0771 658 A2 and high water-fastness, related patent light fastness applications Aqueous, Water based ink which Environmentally Slow drying IJ02, IJ04, IJ21, pigment typically contains: friendly Corrosive IJ26, IJ27, IJ30 water, pigment, No odor Pigment may Silverbrook, EP surfactant, humectant, Reduced bleed clog nozzles 0771 658 A2 and and biocide. Reduced wicking Pigment may related patent Pigments have an Reduced clog actuator applications advantage in reduced strikethrough mechanisms Piezoelectric ink- bleed, wicking and Cockles paper jets strikethrough. Thermal ink jets (with significant restrictions) Methyl MEK is a highly Very fast drying Odorous All IJ series ink Ethyl volatile solvent used Prints on various Flammable jets Ketone for industrial printing substrates such as (MEK) on difficult surfaces metals and plastics such as aluminum cans. Alcohol Alcohol based inks Fast drying Slight odor All IJ series ink (ethanol, 2- can be used where the Operates at sub- Flammable jets butanol, printer must operate at freezing and others) temperatures below temperatures the freezing point of Reduced paper water. An example of cockle this is in-camera Low cost consumer photographic printing. Phase The ink is solid at No drying time- High viscosity Tektronix hot change room temperature, and ink instantly freezes Printed ink melt piezoelectric (hot melt) is melted in the print on the print medium typically has a ink jets head before jetting. Almost any print ‘waxy’ feel 1989 Nowak Hot melt inks are medium can be used Printed pages USP 4,820,346 usually wax based, No paper cockle may ‘block’ All IJ series ink with a melting point occurs Ink temperature jets around 80° C. After No wicking may be above the jetting the ink freezes occurs curie point of almost instantly upon No bleed occurs permanent magnets contacting the print No strikethrough Ink heaters medium or a transfer occurs consume power roller. long warm-up time Oil Oil based inks are High solubility High viscosity: All IJ series ink extensively used in medium for some this is a significant jets offset printing. They dyes limitation for use in have advantages in Does not cockle ink jets, which improved paper usually require a characteristics on Does not wick low viscosity. Some paper (especially no through paper short chain and wicking or cockle). multi-branched oils Oil soluble dies and have a sufficiently pigments are required. low viscosity. Slow drying Micro- A microemulsion is a Stops ink bleed Viscosity higher All IJ series ink emulsion stable, self forming High dye than water jets emulsion of oil, water, solubility Cost is slightly and surfactant. The Water, oil, and higher than water characteristic drop size amphiphilic soluble based ink is less than 100 nm, dies can be used High surfactant and is determined by Can stabilize concentration the preferred curvature pigment required (around of the surfactant. suspensions 5%) 

What is claimed is:
 1. A method of manufacturing an ink jet printhead which includes: providing a substrate; depositing a plurality of sacrificial and permanent layers on the substrate and etching said layers to create an actuator on the substrate; depositing a further permanent layer on the substrate and etching said further permanent layer to form a plunger; depositing a further sacrificial layer about said plunger and depositing yet a further permanent layer on said further sacrificial layer to form a nozzle chamber defining portion; etching said yet further permanent layer to form a nozzle; etching said further sacrificial layer to free the plunger and to form the nozzle chamber with the plunger being arranged reciprocally within said nozzle chamber to be displaceable towards and away from the nozzle to effect ink ejection and nozzle chamber refill, respectively, and the actuator being arranged externally of said nozzle chamber to effect reciprocation of the plunger.
 2. A method of manufacturing an ink jet printhead as claimed in claim 1 wherein multiple ink jet printheads are formed simultaneously on the substrate.
 3. A method of manufacturing an ink jet printhead as claimed in claim 1 wherein said substrate is a silicon wafer.
 4. A method of manufacturing an ink jet printhead as claimed in claim 1 wherein integrated drive electronics are formed on the substrate.
 5. A method of manufacturing an ink jet printhead as claimed in claim 4 wherein said integrated drive electronics are formed using a CMOS fabrication process.
 6. A method of manufacturing an ink jet printhead as claimed in claim 1 wherein ink is ejected from said substrate normal to said substrate.
 7. A method of manufacturing an ink jet printhead as claimed in claim 1 in which the plunger is magnetically responsive and in which the method includes forming the actuator as a series of electromagnets which are sequentially activated to cause stepwise displacement of the plunger, in use.
 8. A method of manufacturing an ink jet printhead as claimed in claim 1 which includes rendering a head of the plunger hydrophobic.
 9. A method of manufacture of an ink jet printhead arrangement including a series of nozzle chambers, said method comprising the steps of: (a) providing an initial semiconductor wafer having an electrical circuitry layer formed thereon; (b) depositing and etching a first sacrificial layer forming a lower electrical coil mould; (c) depositing and etching a first conductive material layer including a lower electrical coil portion interconnected with said electrical circuitry layer; (d) depositing and etching an inert material layer over said first conductive material layer, said inert material layer including predetermined vias for interconnection of said first conductive material layer with subsequently deposited layers; (e) depositing and etching a second sacrificial layer including etching a mould for a fixed magnetic pole, a series of moving poles, horizontal guides and a core pusher rod; (f) depositing and etching a saturation flux material layer to form said fixed magnetic pole, said series of moving poles, said horizontal guides and said core pusher rod; (g) depositing and etching a second inert material layer over said saturation flux material including etching predetermined vias for interconnection of lower layers with subsequent layers; (h) depositing and etching a second conductive material layer including a side electrical coil portion interconnected with said first conductive material layer; (i) depositing and etching a third conductive material layer including a top electrical coil portion interconnected with said side conductive material layer; (j) depositing and etching a hydrophobic material layer to form a plunger element surrounding said core pusher rod; (k) depositing and etching a third sacrificial material layer to form a nozzle chamber mould; (l) depositing and etching a third layer of inert material around said plunger element to form a nozzle chamber; (m) etching an ink supply channel to said nozzle chamber; and (n) etching away said sacrificial layers.
 10. A method as claimed in claim 9 wherein said conductive layers comprise substantially copper.
 11. A method as claimed in claim 9 wherein said inert layers comprise substantially silicon nitride.
 12. A method as claimed in claim 9 further including the step of depositing corrosion barriers over portions of said arrangement so as to reduce corrosion effects.
 13. A method as claimed in claim 9 wherein said hydrophobic layer comprises substantially polytetrafluoroethylene.
 14. A method as claimed in claim 9 wherein said step (m) comprises etching an ink supply channel through said wafer.
 15. A method as claimed in claim 9 wherein said wafer comprises a double sided polished CMOS wafer.
 16. A method as claimed in claim 9 wherein at least step (n) is also utilised to simultaneously separate said wafer into separate printheads. 